PIM ID
437
Brand Characteristics

New Semiconductor Substrate Material, R-1515V, Improves Assembly-Level Reliability

Panasonic's new semiconductor packaging material, R-1515V, enables both low package warpage and high assembly-level reliability. This new material has very low thermal expansion properties which reduces the warping of the substrate during the packaging process. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve reliability.

Suitable for IoT, V2X, 5G and other leading-edge technologies.

Panasonic Electronic Materials Presents Two Technical Papers at ECTC 2021

The Electronic Components and Technology Conference (ECTC) is the premier international conference that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. It is an online format again this year, with presentations available during the month of June.

New Prepreg for Millimeter Wave Antennas: R-5410

Now available is Panasonic’s new halogen-free, ultra-low transmission loss multi-layer Circuit Board Prepreg. This new Prepreg enables multi-layer millimeter wave antenna construction using industry-standard manufacturing processes and equipment.

Applications include millimeter-wave antenna Circuit Boards, automotive millimeter-wave radar, wireless communication base stations and high-transmission speed multi-layer Circuit Boards.

Key benefits include lower transmission loss, ease of construction, and reduced manufacturing costs.

New Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

Ideal for automotive electronics which need to function under extreme conditions, this Sidefill contributes to improved reliability of surface mount semiconductor packages and enables easier handling during manufacture due to long pot life.

Applications include automotive camera modules, automotive communication radar, automotive electronic control units (ECUs), next-generation cockpits, and headlights.

Panasonic RUGGED RANTS Podcast Answers What Are E-Textiles!

The Panasonic RUGGED RANTS Podcast provides a tough and at times a bold conversation on the future of innovation and what we can expect as work changes.

Hosted by Panasonic TOUGHBOOK's Barry Ross, Episode 20: What Do Smart Clothing & Foldable Phones Have In Common? features a candid conversation with Mr. Nick DeGaetano from Panasonic Industrial’s New Business Development Team.  Nick helps RUGGED RANTS listeners figure out just exactly what are “Flexible Electronics” and how Wearables and apparel are benefiting from this technology.

What Do Smart Clothing And Foldable Phones Have In Common?

"the big rethink" Podcast Episode 20 Discusses Flexible Electronics And Wearable Applications With Mr. Nick DeGaetano from Panasonic Industrial’s New Business Development Team.

Introducing "the big rethink", a tough and at times, a bold conversation on the future of innovation and what we can expect as work changes.  Hosted by Panasonic TOUGHBOOK’s Barry Ross, Episode 20: What Do Smart Clothing & Foldable Phones Have In Common? features a candid conversation with Mr.